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8/25/2015 by mdc
Charlotte McLeod reports that Rice University reported earlier this week that two of its researchers, Rouzbeh Shahsavari and Navid Sakhavand, have completed the first theoretical analysis of how 3D boron nitride could be used to control heat flow in small electronic devices. According to Shahsavari, the goal of the work is to improve the way heat moves in small electronic devices.

Typically in all electronics, it is highly desired to get heat out of the system as quickly and efficiently as possible, he told the university, adding that in the past the process has been complicated by the fact that when you have layered materials on a substrate where heat moves very quickly in one direction, along a conductive plane, but not so well from layer to layer.

Hexagonal boron nitride, also known as h-BN, or white graphene, may provide a solution. In its 2D form, h-BN looks just like the atom-thick form of carbon known as graphene. Graphene, widely described as the wonder carbon of the 21st century, is well known for being a good conductor of heat, and the same can be said for h-BN.

That ability to conduct heat that piqued the interest of Shahsavari and Sakhavand, and they began looking into how h-BN might be used to control heat flow. Ultimately, they discovered that while heat moves ballistically across planes of boron nitride, h-BN planes connected by boron nitride nanotubes to form 3D structures should be able to transport heat in all directions, whether in-plane or across planes, as mentioned, that is in contrast to what happens in most electronics, where heat moves quickly along a conductive plane, but moves poorly from layer to layer.

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Open Resource  |  2015/08/25  |  334 Report Broken   Tell Friend

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